DocumentCode
2034013
Title
In situ study of thermal deformation of metal resistive heater on silicon nitride membrane by digital holographic microscopy
Author
Lai, Yiu Wai ; Lee, Joshua E -Y
Author_Institution
City Univ. of Hong Kong, Kowloon, China
fYear
2012
fDate
5-8 March 2012
Firstpage
557
Lastpage
561
Abstract
Metal resistive heater on dielectric membrane structures are common in MEMS. In this paper, the evolution of the surface topography of this type of structure during operation is studied by in situ digital holographic microscopy with nanometer-scale resolution. Devices of a typical design with platinum resistive heater lying on 200 nm silicon nitride membrane were fabricated by standard MEMS processes. A permanent out-of-plane surface deformation up to 200 nm could be detected when applying heating cycles via real-time in situ images of the device surface profile. Such deformation bears the risk of failure in the thin membrane device.
Keywords
deformation; dielectric materials; holography; membranes; micromechanical devices; resistance heating; silicon compounds; surface topography; thermal analysis; MEMS process; SiN; dielectric membrane structure; digital holographic microscopy; heating cycle; metal resistive heater; nanometer-scale resolution; platinum resistive heater; silicon nitride membrane; size 200 nm; surface deformation; surface topography; thermal deformation; thin membrane device; Atomic measurements; Cooling; Heating; Micromechanical devices; Microscopy; Phase distortion; Silicon; digital holograpic microscopy; membrane; microheater;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location
Kyoto
Print_ISBN
978-1-4673-1122-9
Type
conf
DOI
10.1109/NEMS.2012.6196837
Filename
6196837
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