• DocumentCode
    2034013
  • Title

    In situ study of thermal deformation of metal resistive heater on silicon nitride membrane by digital holographic microscopy

  • Author

    Lai, Yiu Wai ; Lee, Joshua E -Y

  • Author_Institution
    City Univ. of Hong Kong, Kowloon, China
  • fYear
    2012
  • fDate
    5-8 March 2012
  • Firstpage
    557
  • Lastpage
    561
  • Abstract
    Metal resistive heater on dielectric membrane structures are common in MEMS. In this paper, the evolution of the surface topography of this type of structure during operation is studied by in situ digital holographic microscopy with nanometer-scale resolution. Devices of a typical design with platinum resistive heater lying on 200 nm silicon nitride membrane were fabricated by standard MEMS processes. A permanent out-of-plane surface deformation up to 200 nm could be detected when applying heating cycles via real-time in situ images of the device surface profile. Such deformation bears the risk of failure in the thin membrane device.
  • Keywords
    deformation; dielectric materials; holography; membranes; micromechanical devices; resistance heating; silicon compounds; surface topography; thermal analysis; MEMS process; SiN; dielectric membrane structure; digital holographic microscopy; heating cycle; metal resistive heater; nanometer-scale resolution; platinum resistive heater; silicon nitride membrane; size 200 nm; surface deformation; surface topography; thermal deformation; thin membrane device; Atomic measurements; Cooling; Heating; Micromechanical devices; Microscopy; Phase distortion; Silicon; digital holograpic microscopy; membrane; microheater;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4673-1122-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2012.6196837
  • Filename
    6196837