• DocumentCode
    2034311
  • Title

    Percolation model for electrical breakdown in insulating polymers

  • Author

    Wu, K. ; Dissado, L.A.

  • Author_Institution
    Dept. of Eng., Leicester Univ., UK
  • fYear
    2004
  • fDate
    17-20 Oct. 2004
  • Firstpage
    514
  • Lastpage
    518
  • Abstract
    A percolation model for intrinsic breakdown in insulating polymers is presented, which indicates that an extended state for charge carriers can be formed due to the reduction of the trap barriers at a high enough electrical field, and that breakdown can be induced by the current multiplication in the extended state. This model provided an estimated value of breakdown strength close to the actual value. By considering the interactions between trap barrier potentials, the effect of electrical aging can be explained in term of an increase in trap density. Many phenomena, such as the effect of weak points, the change of breakdown strength with the content of comonomers or additives, and the changes in electroluminescence during electrical tree initiation can also be explained using this model.
  • Keywords
    additives; ageing; electric breakdown; electric strength; electroluminescence; organic insulating materials; percolation; polymer blends; trees (electrical); additive content; breakdown strength; charge carrier extended state; comonomer content; current multiplication; dielectric breakdown; electrical aging; electrical breakdown percolation model; electrical tree initiation; electroluminescence; insulating polymer intrinsic breakdown; trap barrier potentials interaction; trap barrier reduction; trap density; weak point effects; Aging; Avalanche breakdown; Charge carriers; Dielectrics and electrical insulation; Electric breakdown; Electron traps; Impact ionization; Lattices; Plastic insulation; Polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
  • Print_ISBN
    0-7803-8584-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2004.1364300
  • Filename
    1364300