• DocumentCode
    2034579
  • Title

    Effect of coating organic film on dropwise condensation in microgrooves with nanostructure surface

  • Author

    Sheu, T.S. ; Shyu, J.C. ; Hsiao, J.W. ; Pan, Y.C.

  • Author_Institution
    Dept. of Mech. Eng., R.O.C. Mil. Acad., Kaohsiung, Taiwan
  • fYear
    2012
  • fDate
    5-8 March 2012
  • Firstpage
    661
  • Lastpage
    664
  • Abstract
    The Standard photolithography and wet etching technology were applied to prepare the hydrophobic of microgrooves surface on copper plate. The organic STA film were coating on microgrooves surface to promote the dropwise condensation. The experimental data show that the STA coated microgrooves with nanostructure surface show a better performance of hydrophobicity and a larger apparent contact angle. The STA coated microgrooves with nanostructure surface shows a better the heat transfer performance than the microgrooves surface with nanostructures. An increase of the droplet departure diameter and a lower departure frequency, for a larger contact angle hystersis on the microgrooves surface during the DWC process, also results in a decrease in the heat transfer performance of microgrooves nanostructure surface without STA.
  • Keywords
    condensation; contact angle; copper; etching; heat transfer; hydrophobicity; organic compounds; photolithography; surface structure; thin films; Cu; contact angle hystersis; copper plate surface hydrophobic microgrooves; departure frequency; droplet departure diameter; dropwise condensation; heat transfer performance; hydrophobicity; microgroove nanostructure surface; nanostructured surface; organic STA film coating; organic film coating effects; photolithography technology; wet etching technology; Etching; Heating; Ultrasonic variables measurement; Volume measurement; dropwise condensation; microgroovrs; organic film;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4673-1122-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2012.6196862
  • Filename
    6196862