• DocumentCode
    2036175
  • Title

    Design optimization for electrical performance of a LFBGA package using EM-field simulation

  • Author

    Hunat, C. ; Tubulo, C. ; Chuen Khiang Wang ; Ren Liang ; Suthiwongsunthorn, Nathapong

  • Author_Institution
    United Test & Assembly Center Ltd., Singapore, Singapore
  • fYear
    2012
  • fDate
    5-7 Dec. 2012
  • Firstpage
    770
  • Lastpage
    773
  • Abstract
    In this paper we presented methods of optimizing a 17×17mm LFBGA package having improve its electrical performance using an electromagnetic-field software through simulation, particularly on controlled signals (single-end & differential pairs) and high-speed I/O signal traces.
  • Keywords
    ball grid arrays; design engineering; electromagnetic fields; EM field simulation; LFBGA package; design optimization; electrical performance; electromagnetic field software; Conferences; Electronics packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-4553-8
  • Electronic_ISBN
    978-1-4673-4551-4
  • Type

    conf

  • DOI
    10.1109/EPTC.2012.6507188
  • Filename
    6507188
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2036175