Design and Simulation of On-Chip Lossy Transmission Line Pairs

Author

Demeester, Thomas ; Zutter, Daniel De

Author_Institution

Dept. of Inf. Technol., Ghent Univ., Ghent

fYear

2008

fDate

12-15 May 2008

Firstpage

1

Lastpage

2

Abstract

A quasi-TM reciprocity based multi-conductor transmission line model is used to investigate the influence of the geometry on the performance of on-chip transmission line pairs for high-frequency differential signal transmission. It is shown that both the knowledge of the fundamental transmission line modes and of the internal impedance of both connected circuits, are essential for a good design.

Keywords

VLSI; coupled transmission lines; high-frequency transmission lines; integrated circuit design; integrated circuit interconnections; multiconductor transmission lines; VLSI circuit design; fundamental transmission line modes; high-frequency differential signal transmission; interconnects; internal impedance; multiconductor transmission line model; on-chip coupled lossy transmission line pair design; quasiTM reciprocity; Conductors; Distributed parameter circuits; Frequency; Impedance; Multiconductor transmission lines; Power transmission lines; Propagation losses; Transmission line matrix methods; Transmission line theory; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on

Conference_Location

Avignon

Print_ISBN

978-1-4244-2317-0

Electronic_ISBN

978-1-4244-2318-7

Type

conf

DOI

10.1109/SPI.2008.4558366

Filename

4558366