• DocumentCode
    2040530
  • Title

    Parasitic influence, on signal integrity, of several victim lines placed asymmetrically beside and symmetrically at both sides of an attacker interconnect and mutually

  • Author

    Ponchel, F. ; Legier, Jf ; Paleczny, E. ; Seguinot, C. ; Deschacht, D.

  • Author_Institution
    IEMN, Villeneuve d´´Ascq
  • fYear
    2008
  • fDate
    12-15 May 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Far end crosstalk on victim lines located near an aggressor as well as rise time and propagation delay at the end of the attacker are evaluated. It is done thanks to a home made software based on full wave electromagnetic finite element and transient analysis simulation. These investigations are carried out when the aggressor lossy interconnect of less than one micron square area is symmetrically and asymmetrically placed in an arrangement of three, five and eight copper lossy lines, in case of low, medium and strong mutual effects. Our signal integrity points out that two neighbour lines on both sides of an active interconnect (i.e. the aggressor) are a good compromise to understand more complicated situation on greatest number of unintentionally coupled interconnects. We have verified this fact even in case of small spacing or high permittivity material which filled partially the spacing between interconnects (i.e. strong mutual effects).
  • Keywords
    computational electromagnetics; copper; crosstalk; delay estimation; electromagnetic wave propagation; finite element analysis; integrated circuit interconnections; permittivity; transient analysis; active interconnects; aggressor lossy interconnects; attacker interconnects; copper lossy lines; far end crosstalk; full wave electromagnetic finite element analysis; high permittivity material; home made software; parasitic influence; propagation delay; signal integrity points; time delay; transient analysis simulation; unintentionally coupled interconnects; victim lines; Conducting materials; Copper; Crosstalk; Dielectric materials; Electromagnetic scattering; Finite element methods; Integrated circuit interconnections; Metallization; Predictive models; Propagation delay;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
  • Conference_Location
    Avignon
  • Print_ISBN
    978-1-4244-2317-0
  • Electronic_ISBN
    978-1-4244-2318-7
  • Type

    conf

  • DOI
    10.1109/SPI.2008.4558392
  • Filename
    4558392