• DocumentCode
    2041936
  • Title

    Laminates for MEMS and BioMEMS

  • Author

    Bachman, Mark ; Li, G.-P.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Irvine, Irvine, CA, USA
  • fYear
    2012
  • fDate
    13-16 Dec. 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper describes a new way to build MEMS and BioMEMS devices using laminate technologies borrowed from the packaging industry. This approach to building MEMS departs from the traditional silicon approach, and offers many advantages, including the ability to design and build the package at the same time as the device itself. The use of MEMS fabrication techniques, combined with microelectronics manufacturing technology allows a host of integrated devices to be built using novel materials and processes. This frees the MEMS designer from the significant limitations imposed by silicon and its related materials and processes. Devices can be built that are intended for high power applications, optical applications, or biomedical applications.
  • Keywords
    bioMEMS; electronics packaging; integrated circuit manufacture; laminates; microfabrication; MEMS fabrication techniques; bioMEMS devices; biomedical applications; high power applications; integrated devices; laminate technology; microelectronics manufacturing technology; optical applications; packaging industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
  • Conference_Location
    Lantau Island
  • Print_ISBN
    978-1-4673-4945-1
  • Electronic_ISBN
    978-1-4673-4943-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2012.6507843
  • Filename
    6507843