• DocumentCode
    2043250
  • Title

    Transparent functionalized zinc oxide/epoxy nanocomposite with high thermal performance for high-power light-emitting diodes

  • Author

    Min Zhang ; Kai Zhang ; Xinfeng Zhang ; Chen Yang ; Yuen, Matthew Ming-Fai

  • Author_Institution
    Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2012
  • fDate
    13-16 Dec. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A series of environmentally friendly agents were adopted to functionalize ZnO nanoparticles under moderate conditions. The functionalized ZnO was used as filler of epoxy resin to prepare transparent die attach material. The results show that functionalizations with citric acid and D-gluconic acid greatly improve the dispersion of ZnO in epoxy due to their high chelating capacities with ZnO and good compatibilities with epoxy. The transmittance of nanocomposite for 450 nm visible-light was increased by 27% from 81% to 93% after functionalization with citric acid. The thermal conductivity of 0.2 wt.% citric acid-functionalized ZnO/epoxy nanocomposite is 1.3 times of that of 0.2 wt.% as-synthesized ZnO/epoxy nanocomposite.
  • Keywords
    II-VI semiconductors; filled polymers; nanocomposites; nanofabrication; nanoparticles; resins; thermal conductivity; transparency; visible spectra; wide band gap semiconductors; zinc compounds; D-gluconic acid; ZnO; chelating capacities; citric acid; dispersion; environmentally friendly agents; epoxy resin; filler; functionalized nanoparticles; high thermal performance; high-power light-emitting diodes; thermal conductivity; transmittance; transparent die attach material; transparent functionalized zinc oxide-epoxy nanocomposite; visible-light; wavelength 450 nm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
  • Conference_Location
    Lantau Island
  • Print_ISBN
    978-1-4673-4945-1
  • Electronic_ISBN
    978-1-4673-4943-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2012.6507891
  • Filename
    6507891