Microelectronics packaging processing using focused high power electron beams

It has been demonstrated that focused high-power electron beams are alternatives for patterning next-generation multilayer ceramic packaging. The advantages of using high-power electron beams include high resolution, flexibility, and direct write capability. Higher-density packages can be fabricated using this process tool technology. Electron beams are software-driven. Quick turnaround time can be accomplished for customized packaging circuit designs. Electron beams can efficiently transfer energy to thermally remove ceramic green-sheet materials. Electron-beam machining of ceramic green sheets has been investigated. Experimental results indicate small-size and/or high density via holes can be generated. It is demonstrated that line patterns can be delineated