New fabrication technology of polymer/metal lamination and its application in electronic packaging

Author

Suga, Tadatomo ; Takahashi, Atsushi ; Saijo, Kinji ; Oosawa, Shinji

Author_Institution

Tokyo Univ., Japan

fYear

2001

fDate

21-24 Oct. 2001

Firstpage

29

Lastpage

34

Abstract

A new fabrication technology for lamination between LCP (liquid crystalline polymer)and copper is presented. The method is based on a surface activation process prior to the clad bonding process. The fabrication conditions and the microstructure of the bonded interface as well as the mechanism of the bonding are discussed with respect to various experimental results. Some practical applications of the new clad materials in electronic packaging are also presented.

Keywords

copper; interface structure; laminates; liquid crystal polymers; packaging; surface chemistry; LCP-copper laminates; bonded interface microstructure; bonding mechanism; clad bonding process; clad materials; electronic packaging; fabrication conditions; fabrication technology; liquid crystalline polymer; polymer/metal lamination; surface activation process; Bonding; Copper; Electronic packaging thermal management; Electronics packaging; Fabrication; Laminates; Lamination; Liquid crystal polymers; Printed circuits; Surface contamination;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Conference_Location

Potsdam, Germany

Print_ISBN

0-7803-7220-4

Type

conf

DOI

10.1109/POLYTR.2001.973251

Filename

973251