• DocumentCode
    2046606
  • Title

    Micro dispensing of adhesives and other polymers

  • Author

    Meyer, Wilhelm

  • Author_Institution
    microdrop Gesellschaft fur Mikrodosiersysteme mbH, Germany
  • fYear
    2001
  • fDate
    21-24 Oct. 2001
  • Firstpage
    35
  • Lastpage
    39
  • Abstract
    Due to the progress in miniaturization of electronic and optoelectronic devices, new processing methods are needed for micro dispensing of adhesives and other polymers. Applications are found in fields like joining, marking and coating. Here, micro dispensing is defined in volume ranges of 30-500 pl (/spl sim/30-500 ng). Not only small volumes but also precision and flexibility are in high demand. For a certain range of adhesives and other polymers used especially in optoelectronic devices, microdrop provides equipment for microdispensing. The basic technique is a spin-off from inkjet-technology and profits from the flexibility and precision of this technology due to the contactless drop ejection. Also, extremely aggressive organic solvents do not cause problems for the valve-free dispensers. This makes the microdrop technology very attractive for solved polymers as used for LEP (light emitting polymer) applications. Here, the actual applications and possibilities are illustrated and the current developments for improved processing strategies are described. There are some demands on the properties of such polymers usable for micro dispensing. These are explained and the limitations are discussed.
  • Keywords
    LED displays; adhesives; integrated circuit technology; microassembling; optical polymers; packaging; polymers; process control; 30 to 500 ng; OLED displays; adhesives; aggressive organic solvents; coating; contactless drop ejection; dispensing flexibility; dispensing precision; electronic devices; inkjet-technology; joining; light emitting polymer applications; marking; micro dispensing; micro dispensing volume ranges; microdispensing equipment; microdrop technology; miniaturization; optoelectronic devices; polymer properties; polymers; processing methods; processing strategies; solved polymers; technology flexibility; technology precision; valve-free dispensers; Acceleration; Actuators; Coatings; Glass; Optical fibers; Optical polymers; Optoelectronic devices; Organic light emitting diodes; Solvents; Surface tension;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
  • Conference_Location
    Potsdam, Germany
  • Print_ISBN
    0-7803-7220-4
  • Type

    conf

  • DOI
    10.1109/POLYTR.2001.973252
  • Filename
    973252