DocumentCode
2046684
Title
Development of polymeric insulating materials for HVDC cables using additives: evidence from a multitude of experiments using different techniques
Author
Khalil, M. Salah ; Jervase, J.A.
Author_Institution
Dept. of Electr. & Electron. Eng., Sultan Qaboos Univ., Muscat, Oman
fYear
2000
fDate
2000
Firstpage
485
Lastpage
488
Abstract
The main objective of the present paper is to shed more light on the multiple effects of the incorporation of certain additives into LDPE (low density polyethylene) on some of the properties of the doped material relevant to its use as an insulating material for HVDC cables. In the present work, the effects of two additives on DC insulation resistivity, DC breakdown strength, space charge accumulation under DC conditions, polymer structure and morphology were investigated using different techniques. Results of a multitude of experiments are presented and discussed. It is concluded that, although the incorporation of the additives may lead to certain beneficial effects such as the reduction of space charge density in the polymer and the improvement of the dependence of the DC insulation resistivity on temperature and electric field, yet the DC breakdown strength as well as the DC insulation resistivity itself may be reduced. It is also shown that the incorporation of the additives have a significant effect on the morphology of the doped material
Keywords
electric breakdown; electric strength; electrical resistivity; insulation testing; polyethylene insulation; polymer structure; power cable insulation; space charge; DC breakdown strength; DC insulation resistivity; DSC; HVDC cables; LDPE; Weibull plots; additives effect; morphology; polymer structure; polymeric insulating materials; space charge accumulation; Additives; Cable insulation; Cables; Conductivity; Electric breakdown; HVDC transmission; Morphology; Plastic insulation; Polymers; Space charge;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 2000. Conference Record of the 2000 IEEE International Symposium on
Conference_Location
Anaheim, CA
ISSN
1089-084X
Print_ISBN
0-7803-5931-3
Type
conf
DOI
10.1109/ELINSL.2000.845554
Filename
845554
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