Electronic adhesives new solutions for short cycled manufacturing process

Reactive adhesives, casting resins and encapsulants become more and more important in electronics manufacturing and development. The reasons for this are the trend towards miniaturisation and functional components and weight reduction. The task to bond very different material on a minimum of space securely, permanently and economy-priced with each other, makes the usage of classical joining techniques, such as screwing, riveting or welding nearly impossible. The adhesive, however, which is optimally adjusted to the respective application, is ideally suitable. Due to the markets globalisation and the trend towards outsourcing, the image of modem production firms is more and more dominated by industrial mass production. This leads towards the demand to serve adhesive applications with products which enable mass production with very short cycle times. Photoinitiated curing adhesives perfectly fulfil the requirements. In addition dual curing and heat curing adhesives which represent a further development of photoinitiated products are available for appliers now. The adhesives afford the ability of a quick heat curing at low temperatures. Dam and Fill products based on UV-curing epoxy resins, heat curing Die-Attach adhesives with a quick curing time, are represented in detail as well as new developments in the anisotropic and isotropic area of conductive adhesives for high volume mass production. We observe the range of properties and the reliability of different adhesives in detail.