DocumentCode
2048146
Title
VTE - A new method for the characterisation of thin film thermophysical properties
Author
Kahle, Oldf ; Uhlig, Christoph ; Bauer, Monika
Author_Institution
Polymeric Mater., Brandenburg Univ. of Technol., Cottbus, Germany
fYear
2001
fDate
21-24 Oct. 2001
Firstpage
358
Lastpage
365
Abstract
Variable temperature ellipsometry (VTE) is a new non-destructive method for the thermophysical characterisation of (polymeric) materials in the thin film state by combining spectroscopic ellipsometry with temperature dependency. The variation of temperature opens a complete new use of ellipsometry to investigate thin film properties. The method is suitable especially for characterisation of polymeric layers which play an increasing role in microelectronic and microsystem technique. Polymeric materials often show different properties in the nanometer scale compared to the well investigated bulk state or don´t exists in the bulk state like plasma polymers or CVDs. For this reason, VTE was developed to investigate the physical properties in the thin film state directly. The method can be used to investigate the following thin film polymeric properties and their thickness dependence in the thickness range from 50 nm to some /spl mu/m: coefficient of thermal expansion, glass transition temperature, thermal degradation, kinetic of evaporation of volatiles (low molecular weight components, solvents), absorption of water, thermal stresses, changes in optical properties.
Keywords
ellipsometry; evaporation; glass transition; nondestructive testing; polymer films; thermal expansion; thermal stresses; evaporation kinetics; glass transition temperature; microelectronic technique; microsystem technique; nondestructive method; optical properties; polymeric material; spectroscopic ellipsometry; temperature dependence; thermal degradation; thermal expansion coefficient; thermal stress; thermophysical properties; thin film; variable temperature ellipsometry; water absorption; Ellipsometry; Optical films; Optical polymers; Plasma properties; Plasma temperature; Polymer films; Temperature dependence; Thermal expansion; Thermal stresses; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location
Potsdam, Germany
Print_ISBN
0-7803-7220-4
Type
conf
DOI
10.1109/POLYTR.2001.973309
Filename
973309
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