Polyimide copper thin film redistribution on glass ceramic/copper multilevel substrates

Author

Redmond, T.F. ; Prasad, C. ; Walker, G.A.

Author_Institution

IBM Corp., Hopewell Junction, NY, USA

fYear

1991

fDate

11-16 May 1991

Firstpage

689

Lastpage

692

Abstract

The first-level package developed for Models 820 and 900 of the IBM ES9000 system family combines polymide copper thin-film technology with glass-ceramic technology to provide high wiring density and excellent electrical performance. The realization of the design application of the technology of the IBM ES9000 resulted in the development of several thin-film technologies for packaging. Some of these are: a photolith expose strategy to match the irregular image of a sintered ceramic substrate to a regular photolithographic grid; a reliable, planar layer interconnection structure based on an application of projection laser ablation technology; a novel redundant wiring structure which provides both high yield wiring and terminal metal structures; and a comprehensive, reliable repair strategy

Keywords

IBM computers; mainframes; packaging; wiring; IBM ES9000 system family; IBM computers; Model 820; Model 900; electrical performance; first-level package; glass-ceramic technology; mainframes; photolith expose strategy; planar layer interconnection structure; polymide copper thin-film technology; projection laser ablation technology; redundant wiring structure; repair strategy; wiring density; Ceramics; Copper; Glass; Laser ablation; Laser applications; Packaging; Polyimides; Substrates; Transistors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163955

Filename

163955