DocumentCode
2048773
Title
Machining parameters optimization on micro hole vibration drilling using grey system theory
Author
Xingyu Lai ; Chunyan Yan ; Chunyi Zhan ; Bangyan Ye ; Weiguang Li
Author_Institution
Sch. of Mechatron. Eng., Guangdong Inst. of Sci. & Technol., Zhuhai, China
fYear
2015
fDate
2-5 Aug. 2015
Firstpage
2307
Lastpage
2312
Abstract
The grey system theory is a new technique for performing prediction, relational analysis, and decision making in many areas. In this paper, grey relational analysis was used to optimize the machining parameters with multiple performance characteristics in micro hole vibration drilling. Experiments were conducted on a computer numerical control vertical machining centre and L9 orthogonal array was chosen for the experiments. The drilling parameters namely the vibration frequency, amplitude, feed and spindle speed were optimized based on the multiple performance characteristics including the positional error, aperture error, and burr height. Optimal machining parameters were determined by the grey relational grade obtained from the grey relational analysis. The experimental results show that the vibration frequency is the most significant factor which affects the micro hole vibration drilling and the performance in the drilling process can be effectively improved through the new approach. Confirmation tests verify that the optimal combination of the vibration drilling parameters can reduce the positional error, the aperture error, and the burr height.
Keywords
computerised numerical control; drilling; grey systems; optimisation; vibrations; L9 orthogonal array; computer numerical control vertical machining centre; grey relational analysis; grey system theory; machining parameter optimization; microhole vibration drilling; Accuracy; Apertures; Drilling machines; Feeds; Machining; Optimization; Vibrations; Grey Relational Grade; Micro Hole; Optimization; Orthogonal Array; Vibration Drilling;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation (ICMA), 2015 IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4799-7097-1
Type
conf
DOI
10.1109/ICMA.2015.7237846
Filename
7237846
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