• DocumentCode
    2049168
  • Title

    Multilevel full-chip routing for the X-based architecture

  • Author

    Ho, Tsung-Yi ; Chang, Chen-Feng ; Chang, Yao-Wen ; Chen, Sao-Jie

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2005
  • fDate
    13-17 June 2005
  • Firstpage
    597
  • Lastpage
    602
  • Abstract
    As technology advances into the nanometer territory, the interconnect delay has become a first-order effect on chip performance. To handle this effect, the X-architecture has been proposed for high-performance integrated circuits. The X-architecture presents a new way of orienting a chip´s microscopic interconnect wires with the pervasive use of diagonal routes. It can reduce the wire-length and via count, and thus improve performance and routability. Furthermore, the continuous increase of the problem size of IC routing is also a great challenge to existing routing algorithms. In this paper, we present the first multilevel framework for full-chip routing using the X-architecture. To take full advantage of the X-architecture, we explore the optimal routing for three-terminal nets on the X-architecture and develop a general X-Steiner tree algorithm based on the Delaunay triangulation approach for the X-architecture. The multilevel routing framework adopts a two-stage technique of coarsening followed by uncoarsening, with a trapezoid-shaped track assignment embedded between the two stages to assign long, straight diagonal segments for wirelength reduction. Compared with the state-of-the-art multilevel routing for the Manhattan architecture, experimental results show that our approach reduced wirelength by 18.7% and average delay by 8.8% with similar routing completion rates and via counts.
  • Keywords
    integrated circuit interconnections; integrated circuit layout; mesh generation; network routing; trees (mathematics); Delaunay triangulation; Manhattan architecture; X-based architecture; diagonal routes; general X-Steiner tree algorithm; high-performance integrated circuits; integrated circuit routing; interconnect delay; microscopic interconnect wires; multilevel full-chip routing; three-terminal nets; trapezoid-shaped track assignment; via count reduction; wirelength reduction; Algorithm design and analysis; Computational geometry; Delay effects; Design optimization; Integrated circuit interconnections; Integrated circuit technology; Microscopy; Permission; Routing; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2005. Proceedings. 42nd
  • Print_ISBN
    1-59593-058-2
  • Type

    conf

  • DOI
    10.1109/DAC.2005.193880
  • Filename
    1510400