• DocumentCode
    20537
  • Title

    Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

  • Author

    Hyunseok Oh ; Bongtae Han ; McCluskey, Patrick ; Changwoon Han ; Youn, Byeng D.

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
  • Volume
    30
  • Issue
    5
  • fYear
    2015
  • fDate
    May-15
  • Firstpage
    2413
  • Lastpage
    2426
  • Abstract
    Recent growth of the insulated gate bipolar transistor (IGBT) module market has been driven largely by the increasing demand for an efficient way to control and distribute power in the field of renewable energy, hybrid/electric vehicles, and industrial equipment. For safety-critical and mission-critical applications, the reliability of IGBT modules is still a concern. Understanding the physics-of-failure of IGBT modules has been critical to the development of effective condition monitoring (CM) techniques as well as reliable prognostic methods. This review paper attempts to summarize past developments and recent advances in the area of CM and prognostics for IGBT modules. The improvement in material, fabrication, and structure is described. The CM techniques and prognostic methods proposed in the literature are presented. This paper concludes with recommendations for future research topics in the CM and prognostics areas.
  • Keywords
    insulated gate bipolar transistors; semiconductor device reliability; IGBT condition monitoring; IGBT modules reliability; IGBT physics-of-failure; IGBT prognostics; condition monitoring technique; insulated gate bipolar transistor modules; mission-critical applications; safety-critical applications; Degradation; Failure analysis; Insulated gate bipolar transistors; Junctions; Logic gates; Reliability; Wires; Condition monitoring (CM); insulated gate bipolar transistor (IGBT); physics-of-failure (PoF); prognostics;
  • fLanguage
    English
  • Journal_Title
    Power Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8993
  • Type

    jour

  • DOI
    10.1109/TPEL.2014.2346485
  • Filename
    6874580