DocumentCode
20537
Title
Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review
Author
Hyunseok Oh ; Bongtae Han ; McCluskey, Patrick ; Changwoon Han ; Youn, Byeng D.
Author_Institution
Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
Volume
30
Issue
5
fYear
2015
fDate
May-15
Firstpage
2413
Lastpage
2426
Abstract
Recent growth of the insulated gate bipolar transistor (IGBT) module market has been driven largely by the increasing demand for an efficient way to control and distribute power in the field of renewable energy, hybrid/electric vehicles, and industrial equipment. For safety-critical and mission-critical applications, the reliability of IGBT modules is still a concern. Understanding the physics-of-failure of IGBT modules has been critical to the development of effective condition monitoring (CM) techniques as well as reliable prognostic methods. This review paper attempts to summarize past developments and recent advances in the area of CM and prognostics for IGBT modules. The improvement in material, fabrication, and structure is described. The CM techniques and prognostic methods proposed in the literature are presented. This paper concludes with recommendations for future research topics in the CM and prognostics areas.
Keywords
insulated gate bipolar transistors; semiconductor device reliability; IGBT condition monitoring; IGBT modules reliability; IGBT physics-of-failure; IGBT prognostics; condition monitoring technique; insulated gate bipolar transistor modules; mission-critical applications; safety-critical applications; Degradation; Failure analysis; Insulated gate bipolar transistors; Junctions; Logic gates; Reliability; Wires; Condition monitoring (CM); insulated gate bipolar transistor (IGBT); physics-of-failure (PoF); prognostics;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2014.2346485
Filename
6874580
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