Measurement System for MEMS Dynamics Characterization with Environmental Control Facility

Testing of microstructure dynamics is necessary to develop reliable and marketable microelectromechanical systems (MEMS) products. A measurement system for three-dimensional motions and dynamics characterization of MEMS is presented in this paper. The system integrates phase shifting interferometry, microvision, stroboscopic illumination, and base excitation, thus is able to measure the surface shapes and deformations as well as the in-plane and out-of-plane motions of microstructures. Moreover, it includes an environmental control facility, which can generate variable pressure and/or temperature for MEMS testing. A novel hybrid block matching algorithm is also proposed to extract the in-plane displacement from vision images with a sub-pixel resolution. The experimental work conducted on several typical MEMS devices such as microresonator arrays, AFM cantilevers, pressure sensor membranes and printed circuit boards confirms that such a measurement system is effective and efficient to characterize MEMS dynamics with a nanometer resolution