• DocumentCode
    2057929
  • Title

    Thermal Analysis of a Constant Temperature Pirani Gauge Based on Micro-hotplate

  • Author

    Zhang, Feng T. ; Tang, Zhen A. ; Yu, Jun ; Jin, Ren C.

  • Author_Institution
    Dept. of Electron. Eng., Dalian Univ. of Technol.
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    1072
  • Lastpage
    1075
  • Abstract
    A micro-hotplate (MHP) based Pirani gauge is fabricated using surface-micromachining technology and measured with a typical constant temperature circuit. The measured results show that its sensitive range is at least 10-105 Pa and can be widen when increasing working temperature. According to Fourier method and energy conservation law, heat conduction differential equations of the supporting beams are built and solved to determine the temperature distribution along the beams and heat losses through solid heat conduction at different pressure. Other heat loss mechanisms of the MHP square membrane are also investigated and it has proven that heat losses through solid heat conduction in micro Pirani increase with gas pressure at constant temperature, whereas they were always considered to be independent of gas pressure in previous studies
  • Keywords
    Fourier analysis; electric heating; heat conduction; heat losses; micromachining; micromechanical devices; pressure gauges; surface treatment; thermal analysis; thermal conductivity; 10 to 10-5 Pa; Fourier method; constant temperature Pirani gauge; constant temperature circuit; energy conservation law; heat conduction differential equations; heat losses; microhotplate; solid heat conduction; surface-micromachining technology; thermal analysis; Biomembranes; Circuits; Electrons; Image sensors; Plasma measurements; Plasma temperature; Solids; Temperature distribution; Temperature sensors; Thermal conductivity; Pirani; constant temperature; micro-hotplate; thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334633
  • Filename
    4135132