Integration of IEEE STD.11149.1 and mixed-signal test architectures

Author

Cheek, David J. ; Dandapani, R.

Author_Institution

Dept. of Electr. & Comput. Eng., Colorado Univ., Colorado Springs, CO, USA

fYear

1995

fDate

21-25 Oct 1995

Firstpage

569

Lastpage

576

Abstract

It is shown that the TMS pin of IEEE Std. 1149.1 can also be-used for providing stimulus during analog measurements using the architectures of [Park93] and [Lu94]. This results in the saving of one test pin for these architectures. Simulation results show that mixed-signal testing can be safely performed using the new approach without compromising the effectiveness of the approaches of [Park93] and [Lu94]

Keywords

IEEE standards; automatic testing; design for testability; integrated circuit design; integrated circuit interconnections; integrated circuit testing; mixed analogue-digital integrated circuits; IC design; IC level testing; IEEE STD.11149.1; TMS pin; analog measurements; interconnect failures; mixed-signal test architectures; test effectiveness; Circuit simulation; Circuit testing; Current measurement; Digital integrated circuits; Integrated circuit interconnections; Performance evaluation; Pins; Springs; Switches; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1995. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-2992-9

Type

conf

DOI

10.1109/TEST.1995.529885

Filename

529885

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2058668