• DocumentCode
    2059685
  • Title

    Using the right tools and techniques leads to successful testing of MCMs

  • Author

    Flint, Andrew

  • Author_Institution
    Semicond. Products Sector, Motorola Inc., Tempe, AZ, USA
  • fYear
    1995
  • fDate
    21-25 Oct 1995
  • Firstpage
    673
  • Abstract
    The secret to successfully testing MCM prototype products is to perform the right amount of testing. Attempting to test every transistor inside of each chip in the MCM is likely to result in a failed project, because most MCMs are too complex to test as though they are one large IC. The formula used for several successful projects was to (1) obtain functional ICs, (2) devise tests that verify the ICs are properly interconnected, and (3) run some simple functional tests to verify the MCM performs properly as a unit. Obtaining good chips is usually not a big problem, since most IC manufacturers perform relatively complete testing of the bare ICs. Generating interconnect tests is a straightforward task for many designs. Sometimes design-for-testability (DFT) is required to make the design more readily testable. Functional tests, even very limited ones, are best developed using logic simulation, allowing coverage and correctness to be verified before going to the tester. A brief sampling is presented of specific approaches to consider when planning the strategy
  • Keywords
    design for testability; fault diagnosis; integrated circuit interconnections; integrated circuit testing; multichip modules; production testing; MCM prototype products; assembly verification testing; design-for-testability; fault dictionary; functional IC; functional tests; in-circuit test; interconnect tests; logic simulation; test planning; testing strategies; Circuit faults; Circuit testing; Dictionaries; Integrated circuit interconnections; Integrated circuit testing; Logic testing; Performance evaluation; Semiconductor device testing; Strategic planning; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1995. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-2992-9
  • Type

    conf

  • DOI
    10.1109/TEST.1995.529896
  • Filename
    529896