• DocumentCode
    2060362
  • Title

    Characterization of MOS interfaces on protected and un-protected 4H-SiC surfaces

  • Author

    Lodzinski, M. ; Perez-Tomas, A. ; Guy, O.J. ; Penny, M. ; Batcup, S. ; Al-Hartomy, O.A. ; Dunstan, P. ; Wilks, S. ; Igic, P.

  • Author_Institution
    Sch. of Eng., Univ. of Wales, Swansea
  • fYear
    2008
  • fDate
    11-14 May 2008
  • Firstpage
    541
  • Lastpage
    543
  • Abstract
    In this paper, we present investigations performed on 4H-SiC surfaces annealed at high temperature in the presence of a protective carbon cap and compare these to samples fabricated by the same process, but without a protective layer. The high temperature treatment resulted in sample surfaces with various roughnesses. The annealed samples have been oxidised to fabricate MOS structures in order to investigate the effect of annealing on the physical properties SiO2/SiC interfaces. Structures have been characterized using C-V measurements. Results suggest that treatments to reduce surface roughness caused by annealing, prior to any oxidation, are effective in reducing the density of interface traps. The density of SiO2/SiC interface traps for samples treated prior to oxidation is lower than interface trap densities for annealed samples with no preoxidation roughness reduction treatment.
  • Keywords
    MOS capacitors; annealing; carbon; high-temperature techniques; oxidation; silicon compounds; surface roughness; C-V measurements; H-SiC; MOS capacitors; MOS interfaces; MOS structures; MOSFET technology; SiO2-SiC; high temperature treatment; interface traps; oxidation; physical properties; protective carbon cap; roughness reduction treatment; surface annealing; surface roughness; Interface states; Oxidation; Plasma temperature; Protection; Rapid thermal annealing; Rough surfaces; Silicon carbide; Surface morphology; Surface roughness; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2008. MIEL 2008. 26th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    978-1-4244-1881-7
  • Electronic_ISBN
    978-1-4244-1882-4
  • Type

    conf

  • DOI
    10.1109/ICMEL.2008.4559342
  • Filename
    4559342