3D hybrid modeling of substrate coupling noise in lightly doped mixed-signal ICs

Author

Yongsheng Wang ; Fang Li ; Hualing Yang ; Yonglai Zhang ; Yanhui Ren

Author_Institution

Micro-Electron. Dept., Harbin Inst. of Technol., Harbin, China

fYear

2013

fDate

28-31 Oct. 2013

Firstpage

1

Lastpage

4

Abstract

Because of the widely used of mixed-signal SoC, substrate coupling noise has become an important problem. A reasonable substrate model is necessary for estimating the impact of substrate noise. Compared with previous work, the proposed 3D hybrid model includes 3D RC substrate network for the aggressor and victim and macro model for the noise coupling path. Developed model of commonly used for isolating noise such as guard ring is also proposed. The efficiency of different regions of guard ring and single and double guard ring are compared and analyzed to draw a general conclusion.

Keywords

integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; system-on-chip; three-dimensional integrated circuits; 3D RC substrate network; 3D hybrid modeling; double guard ring; lightly doped mixed-signal ICs; macromodel; mixed-signal SoC; noise coupling path; single guard ring; substrate coupling noise; Computational modeling; Couplings; Integrated circuit modeling; Noise; Solid modeling; Substrates; Three-dimensional displays; 3D hybrid model; 3D substrate model; Guard ring isolation; Micro model; substrate coupling noise;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC (ASICON), 2013 IEEE 10th International Conference on

Conference_Location

Shenzhen

ISSN

2162-7541

Print_ISBN

978-1-4673-6415-7

Type

conf

DOI

10.1109/ASICON.2013.6811905

Filename

6811905