DocumentCode
2066023
Title
Microelectronics packaging curriculum development at San Jose State University
Author
Selvaduray, Guna S. ; Baret, Frederic
Author_Institution
Coll. of Eng., San Jose State Univ., CA, USA
fYear
1997
fDate
18-21 May 1997
Firstpage
182
Lastpage
186
Abstract
This paper describes the development of an engineering education curriculum in microelectronic packaging at both the undergraduate and graduate levels, at the College of Engineering, San Jose State University. Motivation for establishing courses to support such a curriculum and the needs of the local electronics industry are discussed. The undergraduate courses are taught in the lecture/laboratory mode, thus requiring students to conduct experiments. The interdisciplinary graduate curriculum is offered as an area of specialization within the Master of Science in Engineering program. Guest speakers from industry are invited to discuss advances and challenges present in this constantly evolving field. The College also offers short courses for engineers practicing in industry. With NSF funding, workshops for skills enhancement of university faculty are currently in the planning stage; four such workshops will be offered during 1997-1998
Keywords
continuing education; educational courses; electronic engineering education; integrated circuit packaging; San Jose State University; engineering education; interdisciplinary graduate curriculum; microelectronic packaging; undergraduate courses; Curriculum development; Educational institutions; Electronic packaging thermal management; Electronics packaging; Heat transfer; Industrial electronics; Microelectronics; Storage area networks; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606166
Filename
606166
Link To Document