• DocumentCode
    2066023
  • Title

    Microelectronics packaging curriculum development at San Jose State University

  • Author

    Selvaduray, Guna S. ; Baret, Frederic

  • Author_Institution
    Coll. of Eng., San Jose State Univ., CA, USA
  • fYear
    1997
  • fDate
    18-21 May 1997
  • Firstpage
    182
  • Lastpage
    186
  • Abstract
    This paper describes the development of an engineering education curriculum in microelectronic packaging at both the undergraduate and graduate levels, at the College of Engineering, San Jose State University. Motivation for establishing courses to support such a curriculum and the needs of the local electronics industry are discussed. The undergraduate courses are taught in the lecture/laboratory mode, thus requiring students to conduct experiments. The interdisciplinary graduate curriculum is offered as an area of specialization within the Master of Science in Engineering program. Guest speakers from industry are invited to discuss advances and challenges present in this constantly evolving field. The College also offers short courses for engineers practicing in industry. With NSF funding, workshops for skills enhancement of university faculty are currently in the planning stage; four such workshops will be offered during 1997-1998
  • Keywords
    continuing education; educational courses; electronic engineering education; integrated circuit packaging; San Jose State University; engineering education; interdisciplinary graduate curriculum; microelectronic packaging; undergraduate courses; Curriculum development; Educational institutions; Electronic packaging thermal management; Electronics packaging; Heat transfer; Industrial electronics; Microelectronics; Storage area networks; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1997. Proceedings., 47th
  • Conference_Location
    San Jose, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-3857-X
  • Type

    conf

  • DOI
    10.1109/ECTC.1997.606166
  • Filename
    606166