DocumentCode
2066309
Title
Microelectronics and electronic packaging education and research at Virginia Tech
Author
Elshabini-Riad, Aicha ; Barlow, Fred D.
Author_Institution
Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fYear
1997
fDate
18-21 May 1997
Firstpage
187
Lastpage
190
Abstract
Instruction and research at Virginia Tech, in the area of Microelectronics and Electronic Packaging, center around a core group of students and faculty in the Microelectronics Laboratory. This group offers courses in microelectronics with a strong emphasis on multichip module design and fabrication, interconnects, and electronic packaging, and include an introductory course in microelectronics as well as several graduate courses in electronic packaging, electronic devices, and microwave circuit design and fabrication. This paper outlines these instructional and research efforts as well as the capabilities of the Microelectronics laboratory. In addition, the courses structure and recent efforts to expand the microelectronics education to include integrated circuit fabrication, as well as advances in power electronic packaging will be discussed in this paper
Keywords
electronic engineering education; packaging; Virginia Tech; education; electronic devices; electronic packaging; integrated circuit fabrication; interconnects; microelectronics; microwave circuits; multichip modules; power electronics; research; Circuit synthesis; Electronics packaging; Fabrication; Integrated circuit interconnections; Integrated circuit packaging; Laboratories; Microelectronics; Microwave devices; Multichip modules; Power electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606167
Filename
606167
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