Multi-Layer Thick-Film Technology: A Convenient Way to Design Compact and Efficient Microwave Components

In current communication systems, significant efforts are being made concerning the miniaturization of the different microwave integrated sub-functions involved. In addition to size considerations, acceptable performance and insensitivity to external phenomena (like temperature, vibrations, acceleration, etc ...) remain essential criteria for their validity (especially for spacial applications, mobile communications devices, etc...). in this way, Multi-layer Thick-film technology is very apprpriate for developing such compact and efficient integrated systems. The purpose of this paper is to show the possibilities and the interesting properties of this particular technological process. By considering simple test structures and using corresponding equivalent circuits, we have built numerous microwave functions, like filters, couplers, DC-Blocks, etc.. with good performances, rarely achieved before using the classical approach.