• DocumentCode
    2069576
  • Title

    Non-contact probing in millimeter wave transmitter characterizations

  • Author

    Ding, Hanyi ; Szenher, Francis F. ; Feng, Kai ; Burnett, Randall M., II ; Paganini, Andrea ; Morton, Robert

  • Author_Institution
    IBM, Essex Junction, VT
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    809
  • Lastpage
    814
  • Abstract
    The lack of access points to internal circuits can prevent full debug and characterization of highly integrated circuits, such as a receiver or transmitter on a chip. To maximize coverage, prevent costly re-spin and improve time to market, innovative characterization and test solutions need to be developed. In this paper loop antennae have been designed and utilized as a non-contact probe in characterizations of on-chip millimeter wave systems. This non-invasive solution is capable to capture (parasitic) signals radiated from the internal stages of a device under characterization otherwise not measurable. In a case study for a super-heterodyne 60 GHz transmitter, the data extracted through this inexpensive approach allows for a thorough investigation of how individual functional blocks within the transmitter chip contribute to the overall system performance.
  • Keywords
    loop antennas; millimetre wave antennas; millimetre wave integrated circuits; radio transmitters; frequency 60 GHz; integrated circuits; loop antennae; millimeter wave transmitter; noncontact probing; on-chip millimeter wave system; super-heterodyne transmitter; Antenna measurements; Circuit testing; Data mining; Millimeter wave integrated circuits; Millimeter wave measurements; Probes; Semiconductor device measurement; System-on-a-chip; Time to market; Transmitters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074104
  • Filename
    5074104