• DocumentCode
    2070862
  • Title

    Equalization of mid-frequency power supply noise via a spectrum-shaping encoder for parallel buses

  • Author

    Wilson, John ; Abbasfar, Aliazam ; Ren, Jihong ; Werner, Carl ; Oh, Dan ; Kim, Joong-Ho ; Luo, Lei ; Eble, John ; Kizer, Jade

  • Author_Institution
    Rambus, Inc., Chapel Hill, NC
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    1122
  • Lastpage
    1126
  • Abstract
    Noise from the simultaneous switching of outputs (SSO) creates a significant problem for high-speed parallel buses that use single-ended signaling. Further exacerbating this problem is the fact that many single-ended interfaces share the return path of numerous signals with the same power delivery network (PDN) used to power the I/O transceiver circuitry. These single-ended interfaces share power and ground conductors in an effort to reduce the cost associated with package pin count and chip pad area. In addition to creating low-cost interfaces, there is a need for performance enhancing techniques that are ldquointerface compatiblerdquo, which helps to ease their adoption. This paper introduces a new concept in bus coding that shapes the spectrum of aggregate bus current in an effort to ldquoequalizerdquo the induced voltage response of a power supply. The single-ended buses discussed in this paper are those used in the industry standard interfaces of today´s graphics systems, and possibly the interfaces that may be used in future generations of main memory.
  • Keywords
    circuit noise; encoding; field buses; power supply circuits; I-O transceiver circuitry; aggregate bus current spectrum; chip pad area; equalization; mid-frequency power supply noise; package pin count; parallel buses; power delivery network; single-ended interfaces; single-ended signaling; spectrum-shaping encoder; Aggregates; Circuits; Conductors; Costs; Electricity supply industry; Packaging; Power supplies; Shape; Transceivers; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074152
  • Filename
    5074152