• DocumentCode
    2071326
  • Title

    Exploiting body biasing for leakage reduction: A case study

  • Author

    Manuzzato, Andrea ; Campi, Fabio ; Rossi, Davide ; Liberali, Valentino ; Pandini, Davide

  • Author_Institution
    Central CAD & Design Solutions, STMicroelectron., Agrate Brianza, Italy
  • fYear
    2013
  • fDate
    5-7 Aug. 2013
  • Firstpage
    133
  • Lastpage
    138
  • Abstract
    In modern System-on-Chip (SoC) designs, the fulfillment of power constraints is one of the most important and challenging tasks. In this framework, the use of both voltage scaling and body biasing techniques is a mainstream strategy largely used for leakage power reduction. This work presents a case study to evaluate the impact of these techniques on an industrial microprocessor-based design. We analyze the impact of body biasing in terms of area penalties and routing efforts. Furthermore, a complete analysis flow is proposed to evaluate the achievable leakage reduction and the expected performance degradation. In order to overcome the limited spectrum of operating configurations covered by a given library set, we propose a practical and effective methodology based on a standard digital design and characterization flow. By using this procedure, a designer can efficiently evaluate the most appropriate leakage/timing trade-offs, and consequently determine the best supply voltage and biasing configurations to implement the design. The experimental results on our testcase demonstrate that body biasing leads to a leakage reduction up to six times with respect to the standard reference supply voltage configuration.
  • Keywords
    integrated circuit design; network routing; power aware computing; system-on-chip; SoC designs; analysis flow; area penalties; body biasing; characterization flow; industrial microprocessor-based design; leakage power reduction; leakage reduction; leakage trade-offs; performance degradation; routing efforts; standard digital design; standard reference supply voltage configuration; system-on-chip designs; timing trade-offs; voltage scaling; Libraries; Power dissipation; Propagation delay; Standards; Substrates; Threshold voltage; Timing; Body biasing; leakage reduction; low power; power dissipation; timing analysis; voltage scaling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI (ISVLSI), 2013 IEEE Computer Society Annual Symposium on
  • Conference_Location
    Natal
  • ISSN
    2159-3469
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2013.6654635
  • Filename
    6654635