DocumentCode
2072349
Title
Chip ultra-thinning and embedding technology for autonomous sensors array applications
Author
Muller, Philippe ; Iker, François ; Soussan, Philippe ; Beyne, Eric ; Carchon, Geert ; Raedt, Walter De
Author_Institution
IMEC vzw, Leuven
fYear
2009
fDate
26-29 May 2009
Firstpage
1437
Lastpage
1439
Abstract
The purpose of the article is to present the integration of embedded dies and passives components both being integrated on a high resistivity silicon (HRSi) substrate. Integrated dies are thinned down to a 17 mum thickness and embedded with their associated passives.
Keywords
chip scale packaging; radiofrequency identification; radiofrequency integrated circuits; Si; autonomous sensors array; embedding; high resistivity silicon substrate; size 17 mum; ultrathinning; Assembly; Conductivity; Electrodes; Etching; Glass; Lithography; Resistors; Sensor arrays; Silicon; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074200
Filename
5074200
Link To Document