Properties of Ag nanoparticle paste for room temperature bonding

Author

Wakuda, Daisuke ; Kim, Keun-Soo ; Suganuma, Katsuaki

Author_Institution

Res. Fellow, Japan Soc. for the Promotion of Sci., Suita

fYear

2009

fDate

26-29 May 2009

Firstpage

1557

Lastpage

1562

Abstract

Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding were investigated. The Ag nanoparticle paste with very small amount of alkylamine dispersant can sinter at room temperature by drying toluene solvent. When the solvent evaporates, sintering with necking growth and coalescence of particles is provoked at least within half an hour and the Ag grain continues to grow gradually for hours. Time-dependent alteration of the shear strength is demonstrated through bonding test at room temperature using Cu plates. Bonding between Ag paste and Cu plate is favorable and breaking occurs inside sintered Ag body. The strength of Ag increases with the progress of sintering at room temperature. The shear strength reaches over 8 MPa after 6 and 12 h drying process.

Keywords

bonding processes; copper; drying; grain growth; nanoparticles; nanotechnology; necking; plates (structures); shear strength; silver; sintering; Ag-Cu; alkylamine dispersant; breaking; drying; grain growth; nanoparticle paste; necking growth; particle coalescence; plates; room temperature bonding; shear strength; sintering; temperature 293 K to 298 K; time 12 h; time 6 h; toluene solvent; Bonding; Heating; Inorganic materials; Methanol; Nanoparticles; Solvents; Stability; Temperature; Testing; X-ray diffraction;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4244-4475-5

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2009.5074220

Filename

5074220