• DocumentCode
    2073078
  • Title

    Shielding effectiveness of cylindrical enclosures with rectangular apertures

  • Author

    Zheng, Boyu ; Shen, Zhongxiang

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
  • fYear
    2008
  • fDate
    19-23 May 2008
  • Firstpage
    710
  • Lastpage
    713
  • Abstract
    This paper presents an efficient numerical method to predict the shielding effectiveness of a cylindrical enclosure with a rectangular slot. The problem is initially divided into two parts using the field equivalence principle: one is the half free space with a plane wave illumination and a magnetic current on the aperture surface and the other is the rectangular-to-circular waveguide junction with one end of the circular waveguide being shorted. The reflection coefficient of the waveguide junction is calculated by the mode-matching method and the magnetic field in the exterior region is modelled using a mixed potential integral equation. The unknown coefficients of the electromagnetic field are obtained by matching the tangential magnetic field along aperture surface. Numerical results are presented and compared to those obtained by Ansoftpsilas high frequency structure simulator (HFSS). Parametrical studies are also conducted for the effect of the location and size of the aperture on the shielding effectiveness.
  • Keywords
    electromagnetic compatibility; electromagnetic shielding; packaging; reflectivity; cylindrical enclosures; field equivalence principle; high frequency structure simulator; mode-matching method; plane wave illumination; reflection coefficient; shielding effectiveness; Apertures; Electromagnetic reflection; Electromagnetic waveguides; Lighting; Magnetic shielding; Planar waveguides; Rectangular waveguides; Surface waves; Waveguide components; Waveguide junctions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-981-08-0629-3
  • Electronic_ISBN
    978-981-08-0629-3
  • Type

    conf

  • DOI
    10.1109/APEMC.2008.4559974
  • Filename
    4559974