• DocumentCode
    2073176
  • Title

    Shielding effectiveness characterization of metallic enclosures with a thin-sheet panel illuminated by a arbitrary polarizations high-power EMP

  • Author

    Liu, Qi-Feng ; Yin, Wen-Yan ; Mao, Jun-Fa ; Liu, Qing-Huo

  • Author_Institution
    Center for Microwave & RF Technol. (CMRFT), Shanghai Jiao Tong Univ., Shanghai
  • fYear
    2008
  • fDate
    19-23 May 2008
  • Firstpage
    730
  • Lastpage
    733
  • Abstract
    This paper presents an improved sub-cell model for modeling thin material in metallic enclosures using the finite-difference time-domain (FDTD) method. The enhanced thin material sub-cell algorithm proposed can model thin magnetic material sheets including their losses. Our FDTD results are compared with the shielding effectiveness obtained by transmission line method, with good agreements achieved. Therefore, the enhanced sub-cell algorithm is further used to predict shielding effectiveness of some metallic enclosures with thin material sheet on the apertures in the presence of an arbitrary polarization high-power ultra-wideband electromagnetic pulse.
  • Keywords
    electromagnetic pulse; electromagnetic shielding; electronics packaging; finite difference time-domain analysis; transmission line theory; arbitrary polarization high-power ultra-wideband electromagnetic pulse; arbitrary polarizations high-power EMP; finite-difference time-domain method; improved sub-cell model; metallic enclosures; shielding effectiveness; thin magnetic material sheets modeling; thin-sheet panel; transmission line method; Apertures; EMP radiation effects; Electromagnetic wave polarization; Finite difference methods; Inorganic materials; Magnetic materials; Sheet materials; Time domain analysis; Transmission lines; Ultra wideband technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-981-08-0629-3
  • Electronic_ISBN
    978-981-08-0629-3
  • Type

    conf

  • DOI
    10.1109/APEMC.2008.4559979
  • Filename
    4559979