• DocumentCode
    2073484
  • Title

    A coaxial probe system for measuring Z-direction electrical resistivity of conductive polymers

  • Author

    Gurrum, Siva P. ; Dunne, Rajiv ; Lamson, Michael

  • Author_Institution
    Technol. & Manuf. Group (TMG), Texas Instrum. Inc., Dallas, TX
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    1643
  • Lastpage
    1647
  • Abstract
    A novel coaxial Kelvin probe technique has been developed to measure the z-axis electrical resistivity of conductive polymer adhesives. The approach uses a very simple test structure, comprising of a sandwich of the conductive adhesive material between two Copper conductors. The coaxial probe includes an outer region through which the current is forced, and an inner probe which senses the surface voltage drop, and is hooked to a nano-voltmeter to enable micro-ohms resistance measurements with high sensitivity. This is followed by detailed finite element modeling of the sample and probe set-up configuration to extract an accurate value for the effective z-axis resistivity of the conductive adhesive, as well as its bulk and interfacial z-resistivity values. This technique has been demonstrated on two candidate conductive materials as well as solder (as a reference). It has the potential to enable rapid optimization and development of conductive polymer adhesive systems for different interfaces and for various applications.
  • Keywords
    adhesive bonding; adhesives; conducting polymers; electrical resistivity; finite element analysis; ohmic contacts; probes; Z-direction electrical resistivity; coaxial Kelvin probe technique; coaxial probe system; conductive adhesive material; conductive polymers; finite element modeling; micro-ohms resistance measurements; surface voltage drop; Coaxial components; Conducting materials; Conductive adhesives; Conductivity measurement; Electric resistance; Electric variables measurement; Kelvin; Materials testing; Polymers; Probes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074235
  • Filename
    5074235