Evaluation of plastic package delamination via reliability testing and fracture mechanics approach

Author

Holalkere, Ven ; Mirano, Susan ; Kuo, An-Yu ; Chen, Wen-Tang ; Sumithpibul, Chalermsak ; Sirinorakul, S.

Author_Institution

Alphatec Group, Santa Clara, CA, USA

fYear

1997

fDate

18-21 May 1997

Firstpage

430

Lastpage

435

Abstract

Material delamination is a commonly encountered reliability problem with plastic surface mount devices. This paper describes a systematic procedure to assess plastic package delamination. In this procedure, the JEDEC reliability tests (EIA/JESD22-A112-A and A113-A), the finite element stress analysis, and the fracture mechanics theory are integrated together for evaluation of the moisture sensitivity of plastic IC packages

Keywords

delamination; finite element analysis; fracture mechanics; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; moisture; plastic packaging; stress analysis; surface mount technology; EIA/JESD22-A112-A; EIA/JESD22-A113-A; IC packages; JEDEC reliability tests; SMD; finite element stress analysis; fracture mechanics; moisture sensitivity; plastic package delamination; reliability testing; surface mount devices; Delamination; Finite element methods; Integrated circuit testing; Materials reliability; Moisture; Plastic integrated circuit packaging; Plastic packaging; Reliability theory; Stress; Surface cracks;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606206

Filename

606206