• DocumentCode
    2075145
  • Title

    Application specified soft error failure rate analysis using sequential equivalence checking techniques

  • Author

    Tun Li ; Dan Zhu ; Sikun Li ; Yang Guo

  • Author_Institution
    Sch. of Comput., Nat. Univ. of Defense Technol., Changsha, China
  • fYear
    2013
  • fDate
    22-25 Jan. 2013
  • Firstpage
    608
  • Lastpage
    613
  • Abstract
    Soft errors have become a critical challenge as a result of technology scaling. However, to evaluate the influence of soft errors in flip-flop (FF) on the failure of circuit is a hard verification problem. Here, we proposed a novel flip-flop soft error failure rate analysis methodology using sequential equivalence checking (SEC) and taking the application behaviors into consideration, which combines the advantage of formal techniques based approaches in completeness and the advantage of application behaviors in accuracy in differentiating vulnerability of FFs. As a result, all the FFs in a circuit are sorted by their failure rates and designers can use this information to perform optimal hardening of selected sequential components against soft errors. Experimental results on an implementation of a SpaceWire end node and the set of the largest ISCAS´89 benchmark sequential circuits demonstrate the efficiency of our approach. Case study on an instruction decoder of a practical 32 bits microprocessor shows the applicable of our methodology.
  • Keywords
    flip-flops; radiation hardening (electronics); sequential circuits; application specified soft error failure rate analysis; benchmark sequential circuits; flip-flop; hard verification problem; sequential equivalence checking techniques; spacewire end node; technology scaling; Benchmark testing; Circuit faults; Computational modeling; Integrated circuit modeling; Robustness; Silicon; Vectors; Application; Failure rate analysis; Sequential equivalence checking; Soft-error;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4673-3029-9
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2013.6509665
  • Filename
    6509665