DocumentCode
2078942
Title
Full-Wave Analysis of Proximity Effects on Microstrip Lines Near the Edge of a Packaged MMIC
Author
Tseng, Jan-Dong ; Tzuang, Ching-Kuang C.
Author_Institution
Institute of Communication Engineering Center for Telecommunication Research, National Chiao Tung University, Hsinchu, Taiwan, R.O.C.
Volume
2
fYear
1990
fDate
9-13 Sept. 1990
Firstpage
1322
Lastpage
1327
Abstract
A newly developed and tested full-wave mode-matching method is employed to accurately analyze the proximity effects that occur in monolithic microwave integrated circuit (MMIC) computer-aided design (CAD) applications. The dispersion characteristics of the proximity effects, which account for microstrip lines near the edge of the substrate and the metallic packaging boundaries, are presented. The new full-wave approach is validated by checking its results in the low frequency limit against the published quasi-TEM data. Excellent agreements among both methods are obtained and the dispersive data for some particular proximity case studies are reported.
Keywords
Circuit testing; Design automation; Dispersion; Integrated circuit packaging; Integrated circuit testing; MMICs; Microstrip; Microwave theory and techniques; Mode matching methods; Proximity effect;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1990. 20th European
Conference_Location
Budapest, Hungary
Type
conf
DOI
10.1109/EUMA.1990.336250
Filename
4136187
Link To Document