A rapid flip chip die bonding method for semiconductor laser diode arrays

We have developed a general method for rapidly bonding semiconductor laser arrays, optical traveling wave amplifier arrays, and other optoelectronic devices to silicon waferboards or submounts. Our method uses octagonal electrodeposited copper bosses to physically register with precision etched inverted pyramidal receptacles in the silicon. Flip-chip bonding of semiconductor laser diode arrays is significantly faster with this method than with a commercial precision flip chip bonder which images the die and the substrate simultaneously (i.e. with the “vision servo” method). The pre-bond die placement window we obtained is compatible with certain standard flip chip bonders. The post-bond positioning accuracy that we have demonstrated is essential for minimizing the worst-case temperature rise in high power semiconductor lasers and high gain traveling wave amplifiers (TWAs) operating at high levels of current injection