• DocumentCode
    2087348
  • Title

    Analysis of concentrations of ternary solution with NaCl and sucrose based on a multifunctional sensor

  • Author

    Wei, Guo ; Shida, Katsunori

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Saga Univ., Japan
  • fYear
    2003
  • fDate
    30 July-1 Aug. 2003
  • Firstpage
    203
  • Lastpage
    208
  • Abstract
    Ternary solution with NaCl and sucrose is widely employed in osmotic dehydration process of food. This paper presents a multifunctional sensor being capable of directly sensing temperature and two physical parameters of solutions namely, ultrasonic velocity and electrical conductivity. Then the concentrations of various components in ternary solution with NaCl and sucrose can be simultaneously analyzed. A regression algorithm based on natural cubic spline interpolation and the least squares method is developed to estimate the concentrations of NaCl and sucrose, which performs the temperature compensation of the multifunctional sensor and decouples the estimations in 4D (four-dimensional) space into 3D (three-dimensional) space. This sensor could prove valuable as a process control sensor in food industry fields.
  • Keywords
    electrical conductivity measurement; food processing industry; least mean squares methods; sensor fusion; splines (mathematics); statistical analysis; temperature control; temperature sensors; ultrasonic velocity measurement; 3D space; 4D space; NaCl; concentration analysis; electrical conductivity; food dehydration; food industry; four-dimensional; least square; multifunctional sensor; natural cubic spline interpolation; osmotic dehydration; process control sensor; regression algorithm; sucrose; temperature sensing; ternary solution; three-dimensional; ultrasonic velocity; Conductivity; Electrodes; Interpolation; Least squares methods; Silver; Spline; Steel; Sugar; Temperature sensors; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multisensor Fusion and Integration for Intelligent Systems, MFI2003. Proceedings of IEEE International Conference on
  • Print_ISBN
    0-7803-7987-X
  • Type

    conf

  • DOI
    10.1109/MFI-2003.2003.1232657
  • Filename
    1232657