• DocumentCode
    2088213
  • Title

    Spectral domain analysis of coupled microstrip transmission lines

  • Author

    Bagby, Jonathan

  • Author_Institution
    Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
  • fYear
    1994
  • fDate
    10-13 Apr 1994
  • Firstpage
    201
  • Lastpage
    203
  • Abstract
    A full-wave spectral-domain integral equation formulation is used to analyze coupled open boundary microstrip transmission lines. A general rigorous formulation is specialized to the case of two identical uniform lines and a method of moments (MOM) solution is implemented. In contrast with earlier subdomain basis MOM solutions, entire-domain basis functions which incorporate appropriate edge conditions for transverse and longitudinal current components are utilized. This allows closed-term evaluation of relevant spatial integrals and results in improved accuracy using far fewer terms. Extensions of earlier results, including characteristic impedances, propagation constants and current distributions are presented for the dominant and first two higher-order coupled modes, and compare favorably to results of other techniques
  • Keywords
    current distribution; integral equations; microstrip lines; numerical analysis; spectral-domain analysis; transmission line theory; characteristic impedances; closed-term evaluation; coupled microstrip transmission lines; current distributions; edge conditions; entire-domain basis functions; full-wave spectral-domain integral equation formulation; identical uniform lines; longitudinal current components; method of moments; propagation constants; spatial integrals; spectral domain analysis; transverse current components; Couplings; Current distribution; Impedance; Integral equations; Message-oriented middleware; Microstrip; Moment methods; Propagation constant; Spectral analysis; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Southeastcon '94. Creative Technology Transfer - A Global Affair., Proceedings of the 1994 IEEE
  • Conference_Location
    Miami, FL
  • Print_ISBN
    0-7803-1797-1
  • Type

    conf

  • DOI
    10.1109/SECON.1994.324297
  • Filename
    324297