• DocumentCode
    2089085
  • Title

    Design and simulation of higher-mode face shear square micromechanical resonators

  • Author

    Tan-Loc Nguyen ; Jingfu Bao ; JunWen Jiang ; Yuan Ling ; Xinyi Li

  • Author_Institution
    Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2013
  • fDate
    24-25 Oct. 2013
  • Firstpage
    177
  • Lastpage
    180
  • Abstract
    Polysilicon face shear (FS) square micro-mechanical resonators based on MEMS technology operating in second-mode have been studied at frequency 70MHz. By carefully designing the electrodes and the exact support beam locations that minimize the anchor loss, these resonators actually achieved higher quality factor Q (exceeding 20,000 with straight beam support) in the second-mode than in the fundamental at the same frequency. With larger dimensions than previous fundamental mode counterparts, these second-mode face shear square resonators show many advantages over the former, such as (1) lower series motional resistance Rx; (2) higher Q; (3) very high maximum vibration amplitude (achieved 4.8nm with 1μm gap size), which is directly proportional to the output current i0 and maximum vibration energy that a resonator can be stored. So that, the second-mode face shear square resonator is highly recommended when designing a face shear square resonator at high frequency.
  • Keywords
    Q-factor; beams (structures); electrodes; micromechanical resonators; vibrations; MEMS technology; anchor loss; frequency 70 MHz; higher-mode face shear square micromechanical resonators; polysilicon face shear square micromechanical resonators; quality factor; second-mode face shear square resonator; series motional resistance; support beam locations; support structure design; Actuators; Micromechanical devices; Resonant frequency; Square resonator; anchor loss; higher-mode; micromechanical resonators; quality factor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Circuits and System Technology (MMWCST), 2013 International Workshop on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/MMWCST.2013.6814599
  • Filename
    6814599