DocumentCode
2091314
Title
Pattern of vertical engineering collaboration between foundry and design service provider
Author
Su, Yea-Huey ; Guo, Ruey-Shan ; Hsiao, Chia-Hsien
Author_Institution
Dept. of Inf. Manage., Nat. Central Univ., Chung-li
fYear
2005
fDate
13-15 Sept. 2005
Firstpage
361
Lastpage
364
Abstract
As IC design and manufacturing complexities continue to increase exponentially, it is becoming less practical for a single company to provide products and services without collaborated partners. The goal of this research is then to explore how foundries and design service providers collaborate with each other under the new business paradigm. By conducting field interviews and empirical study on six collaboration cases, this research proposes four different collaboration patterns, which are: complementary-equity collaboration pattern, agent-equity collaboration pattern, complementary-nonequity collaboration pattern, and agent-nonequity collaboration pattern. There are several findings: 1) when both parties have stronger complementary assets relationship, the transaction cost is lower and the relationship is more stable; 2) long-term partnership and timing governance mechanism reduce negotiation effort and facilitate quick time-to-market; 3) closer collaboration process can significantly reduce the errors in design project
Keywords
foundries; groupware; integrated circuit design; integrated circuit manufacture; production engineering computing; software agents; time to market; IC design; agent-equity collaboration pattern; agent-nonequity collaboration pattern; complementary assets relationship; complementary-equity collaboration pattern; complementary-nonequity collaboration pattern; design service provider; foundry; long-term partnership; manufacturing complexities; time-to-market; timing governance mechanism; transaction cost; vertical engineering collaboration; Collaboration; Companies; Costs; Design engineering; Electronics industry; Foundries; Information management; Manufacturing; Time to market; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9143-8
Type
conf
DOI
10.1109/ISSM.2005.1513378
Filename
1513378
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