Automatic Measurement System for degradation analysis in thin-film AlCu metallizations

Author

Catelani, M. ; Nicoletti, R.

Author_Institution

Dept. of Electron. & Telecommun., Florence Univ., Italy

Volume

3

fYear

2000

fDate

2000

Firstpage

1572

Abstract

In this work a thermal test on multilayered integrated thin-film AlCu resistive structures is performed in order to study physical degradation phenomena involved in thermal treatment of metallization. A complete Automatic Measurement System is designed and realized to acquire resistive and temperature values during all the testing time with the aim to check the degradation process and the reliability performances of the structures under test. The thermostatic oven used for the thermal ageing has been characterized to guarantee specific temperature uniformity and stability

Keywords

aluminium; automatic test equipment; copper; heat treatment; integrated circuit metallisation; integrated circuit testing; multilayers; thermal stability; thermal stresses; thin film resistors; AlCu; AlCu metallization; Automatic Measurement System; degradation analysis; integrated thin-film; multilayered integrated resistive structure; physical degradation; reliability; temperature uniformity; temperature uniformity and stability; thermal ageing; thermal treatment; thermostatic oven; Automatic testing; Metallization; Ovens; Performance evaluation; System testing; Temperature; Thermal degradation; Thermal resistance; Time measurement; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 2000. IMTC 2000. Proceedings of the 17th IEEE

Conference_Location

Baltimore, MD

ISSN

1091-5281

Print_ISBN

0-7803-5890-2

Type

conf

DOI

10.1109/IMTC.2000.848736

Filename

848736