• DocumentCode
    2094490
  • Title

    Automatic netlist extraction for measurement-based characterization of off-chip interconnect

  • Author

    Corey, S.D. ; Yang, A.T.

  • Author_Institution
    Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
  • fYear
    1996
  • fDate
    10-14 Nov. 1996
  • Firstpage
    24
  • Lastpage
    29
  • Abstract
    An approach is presented for modeling board level, package-level, and MCM substrate-level interconnect circuitry based an measured time domain refectometry data. The time-domain scattering parameters of a multiport system are used to extract a SPICE netlist which uses standard elements to match the behavior of the device up to a user-specified cutoff frequency. Linear or nonlinear circuits may be connected to the model ports, and the entire circuit simulated in a standard circuit simulator. Two-port and four-port example microstrip circuits are characterized, and the simulation results are compared with measured data. Delay, reflection transmission, and crosstalk are accurately modeled in each case.
  • Keywords
    SPICE; circuit analysis computing; delays; linear network analysis; microstrip circuits; multichip modules; nonlinear network analysis; time-domain reflectometry; MCM substrate-level interconnect circuitry; SPICE netlist; automatic netlist extraction; circuit simulator; crosstalk; delay; linear circuits; measured time domain refectometry data; measurement-based characterization; microstrip circuits; multichip modules; multiport system; nonlinear circuits; off-chip interconnect; reflection transmission; time-domain scattering parameters; user-specified cutoff frequency; Circuit simulation; Cutoff frequency; Data mining; Integrated circuit interconnections; Nonlinear circuits; Packaging; SPICE; Scattering parameters; Time domain analysis; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1996. ICCAD-96. Digest of Technical Papers., 1996 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    0-8186-7597-7
  • Type

    conf

  • DOI
    10.1109/ICCAD.1996.568905
  • Filename
    568905