DocumentCode
2094781
Title
Motor modeling for EMC simulation by 3-D electromagnetic field analysis
Author
Maki, Kohji ; Funato, Hiroki ; Shao, Liang
Author_Institution
Automotive Products Res. Lab., Hitachi America Ltd., Farmington Hills, MI
fYear
2009
fDate
3-6 May 2009
Firstpage
103
Lastpage
108
Abstract
A building technique of high-frequency motor models by 3-D electromagnetic field analysis has been developed to establish the simulation technology for EMC estimation in the design stage of motor drive systems. Stray capacitance of each part of a motor was calculated by static electric field analysis, while inductance and resistance of its stator windings were calculated by magnetic field analysis. A motor equivalent circuit was then built with these circuit constants to compute frequency characteristics of motor impedance. In order to take eddy current in laminated iron core into account precisely, we analyzed a 3-D model of half thickness of one laminated steel sheet, and a simplified 3-D model of coil end of a motor. We also took the difference between magnetic field distribution of common mode and that of differential mode into account by setting different coil current and boundary conditions in the analyses. The frequency dependence of calculated inductance and resistance was introduced into circuit simulations. As a result, we have obtained frequency characteristics of motor impedance, whose basic features are similar to those of measured data. Possible causes of the discrepancy have also been discussed.
Keywords
electromagnetic compatibility; electromagnetic fields; motor drives; 3D electromagnetic field analysis; EMC simulation; motor drive systems; motor equivalent circuit; motor modeling; static electric field analysis; Analytical models; Circuit simulation; Electromagnetic analysis; Electromagnetic compatibility; Electromagnetic fields; Electromagnetic modeling; Frequency; Inductance; Magnetic analysis; Magnetic fields;
fLanguage
English
Publisher
ieee
Conference_Titel
Electric Machines and Drives Conference, 2009. IEMDC '09. IEEE International
Conference_Location
Miami, FL
Print_ISBN
978-1-4244-4251-5
Electronic_ISBN
978-1-4244-4252-2
Type
conf
DOI
10.1109/IEMDC.2009.5075190
Filename
5075190
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