DocumentCode
2095007
Title
2003 IEEE International Conference on Simulation of Semiconductor Processes and Devices (Cat. No.03TH8679)
fYear
2003
fDate
3-5 Sept. 2003
Abstract
The following topics are dealt with: interconnect and back end; mobility and transport models; fluctuations; numerics for process/device modeling; high field device transport; front end process physics; quantum effects and TCAD applications; heterojunction device physics; compact models.
Keywords
carrier mobility; circuit simulation; fluctuations; high field effects; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; semiconductor device models; semiconductor device noise; semiconductor heterojunctions; semiconductor process modelling; technology CAD (electronics); IC back end processing; IC interconnects; TCAD applications; carrier mobility; carrier transport; compact models; device modeling; fluctuations; front end process physics; heterojunction device physics; high field device transport; process modeling; quantum effects; semiconductor device simulation; semiconductor process simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7826-1
Type
conf
DOI
10.1109/SISPAD.2003.1233621
Filename
1233621
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