DocumentCode
2095954
Title
Dopant diffusion under pressure and stress
Author
Aziz, Michael J.
Author_Institution
Div. of Eng. & Appl. Sci., Harvard Univ., Cambridge, MA, USA
fYear
2003
fDate
3-5 Sept. 2003
Firstpage
137
Lastpage
142
Abstract
The effects of stress on equilibrium point defect populations and on dopant diffusion in strained semiconductors are reviewed. The thermodynamic relationships presented permit the direct comparison of hydrostatic and biaxial stress experiments and of atomistic calculations of defect volumetrics for any proposed mechanism. Experiments on the effects of pressure and stress on the diffusivity of B and Sb are reviewed. The opposite effects of hydrostatic compression and of biaxial compression on the diffusivity are a consequence of the non-local nature of the point defect formation volume. Comparisons between these effects are made to determine quantitatively the anisotropy of the migration volume. The requirements to permit the prediction of the effect of an arbitrary stress state on diffusion in an arbitrary direction are discussed.
Keywords
antimony; boron; diffusion; doping profiles; elemental semiconductors; internal stresses; point defects; semiconductor process modelling; silicon; Si:B; Si:Sb; atomistic calculations; biaxial compression; biaxial stress; defect volumetrics; diffusivity; dopant diffusion; equilibrium point defect populations; hydrostatic compression; hydrostatic stress; migration volume; strained semiconductors; thermodynamic relationships; Anisotropic magnetoresistance; Crystals; Impurities; Pressure control; Semiconductor devices; Stability; Stress control; Thermal expansion; Thermal stresses; Thermodynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7826-1
Type
conf
DOI
10.1109/SISPAD.2003.1233656
Filename
1233656
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