DocumentCode
2098216
Title
Extension of the compression approach to include device metalizations in electromagnetic simulations
Author
Ooms, S. ; De Zutter, Daniel
Author_Institution
Dept. of Inf. Technol., Univ. of Gent, Belgium
Volume
2
fYear
1995
fDate
18-23 June 1995
Firstpage
1054
Abstract
A new technique for the combination of electromagnetic field simulations and analysis of complex active circuits is proposed, allowing the incorporation of the passive metalization of active components into electromagnetic simulations.
Keywords
active networks; circuit analysis computing; digital simulation; electromagnetic fields; metallisation; passive networks; active circuits; active components; compression approach; device metalizations; electromagnetic field analysis; electromagnetic field simulation; electromagnetic simulations; passive metalization; Active circuits; Analytical models; Circuit simulation; Electromagnetic analysis; Electromagnetic devices; Electromagnetic fields; Information analysis; Information technology; Message-oriented middleware; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 1995. AP-S. Digest
Conference_Location
Newport Beach, CA, USA
Print_ISBN
0-7803-2719-5
Type
conf
DOI
10.1109/APS.1995.530198
Filename
530198
Link To Document