DocumentCode
2100439
Title
Numerical Study of Graphite Foams Saturated with Phase Change Materials in Power System Thermal Management
Author
Wu, Bin ; Xing, Yuming
Author_Institution
Sch. of Aeronaut. Sci. & Technol., Beihang Univ., Beijing, China
fYear
2010
fDate
28-31 March 2010
Firstpage
1
Lastpage
5
Abstract
The latent heat storage unit (LHSU) using phase change material (PCM) is a quite attractive passive thermal management technique. Graphite foam-PCMs composite are very useful especially in electronics cooling system for power system applications due to their high energy to weight ratio and thermal response rate. A numerical study is proposed to investigate and predict the thermal behavior and performance of the LHSU using foam-PCMs. A simulation program based on finite volume approach was developed to evaluate the thermal performance of the LHSU, and the enthalpy porosity method was used to analyze the phase change process of PCMs. A line-by-line solver based on tri-diagonal matrix algorithm has been used to iteratively solve algebraic equations. Several numerical investigations were made to study the impact of the key parameters: foam materials porosity and thermal conductivity, the HTF inlet temperature and mass flow rate, on system thermal behavior and performance during the charging mode. This study provides guidelines for PCM-foam system thermal performance and design in electronics cooling applications.
Keywords
foams; phase change materials; thermal management (packaging); electronics cooling system; enthalpy porosity method; finite volume approach; graphite foams; latent heat storage unit; phase change materials; power system thermal management; tri-diagonal matrix algorithm; Analytical models; Electronics cooling; Energy management; Material storage; Phase change materials; Power system management; Power system simulation; Thermal conductivity; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Power and Energy Engineering Conference (APPEEC), 2010 Asia-Pacific
Conference_Location
Chengdu
Print_ISBN
978-1-4244-4812-8
Electronic_ISBN
978-1-4244-4813-5
Type
conf
DOI
10.1109/APPEEC.2010.5448706
Filename
5448706
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